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  6. 3M™ Polyimide Film Tape 5413, 23 in x 36 yd, 1 per case

3M™ Polyimide Film Tape 5413, 23 in x 36 yd, 1 per case

  • Provides excellent surface release and remains dimensionally stable at high temperatures – preventing rework
  • Flame retardancy, chemical and radiation resistance protects surfaces and helps reduce replacement costs
  • Polyethylene tape core instead of cardboard
  • The silicone adhesive's high temperature performance reduces adhesive transfer which helps to eliminate cleaning, enabling high productivity
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Product Details

3M™ Polyimide Film Tape 5413 is made with DuPont™ Kapton® polyimide film and a silicone adhesive. This amber coloured tape is 2.7 mil thick and can be used for PCB solder masking and other high temperature applications, within a range of -73 °C to 260 °C

"Use 3M™ Polyimide Film Tape 5413 for PCB solder masking and other high temperature applications within a range of 73 °C to 260 °C. This amber coloured, 2.7 mil thick tape is made with an polyimide film and a silicone adhesive. It also features a polyethylene tape core instead of cardboard. The silicone adhesive's high temperature performance reduces adhesive transfer which helps eliminate cleaning, allowing you to keep productivity high. Polyimide film provides an excellent release as it doesn’t soften and stays dimensionally stable at high temperatures – preventing rework. Surfaces are protected due to this tapes flame retardancy, chemical and radiation resistance, reducing replacement costs."

  • Provides excellent surface release and remains dimensionally stable at high temperatures – preventing rework
  • Flame retardancy, chemical and radiation resistance protects surfaces and helps reduce replacement costs
  • Polyethylene tape core instead of cardboard
  • The silicone adhesive's high temperature performance reduces adhesive transfer which helps to eliminate cleaning, enabling high productivity
  • Available on cardboard or polyethyelene core

Suggested Applications

  • Use for masking protection of gold fingers of printed circuit boards during wave solder or solder dip process
  • Release surface in fabrication of parts cured at elevated temperature

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