- Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
- Optimized for extended pad and disk life
- Diamonds secured with both chemical and mechanical bonds for superior retention
- 45 degree tapered edge provides some flexibility for feather-edging and blending
Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for superior diamond retention, with controlled diamond placement and protrusion.