3M™ Thermally Conductive Epoxy Adhesive TC-2707

  • Provide a thermal interface between IC packages or PCBs and heat sinks or other cooling devices
  • Get high adhesive strength and excellent surface wet out for applications
  • Use adhesives low viscosity properties for potting applications
  • Good gap filling
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Product Details

Get high adhesive strength and excellent surface wet out with 3M™ Thermally Conductive Epoxy Adhesives. Our adhesives act as a thermal interface between IC packages or PCBs and heat sinks or other cooling devices. With their low viscosity, they can also be used in potting applications

The 3M ™ 2707 Thermally Conductive Adhesive is a two-component epoxy filled with boron nitride (BN). It has good thermal conductivity and good adhesion on many smooth as well as rough surfaces. With the practical double cartridge and matching mixing nozzles exactly the ideal mixing ratio is mixed. The adhesive may be impliziert with the aid of the applicator device directly from the cartridge.

  • Provide a thermal interface between IC packages or PCBs and heat sinks or other cooling devices
  • Get high adhesive strength and excellent surface wet out for applications
  • Use adhesives low viscosity properties for potting applications
  • Good gap filling
  • Thin bonding line
  • Good thermal conductivity (0.72 W/m-K)
  • Low CL ion content and outgassing

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