3M™ Scotch-Weld™ Structural Adhesive Film AF 163-2K .060WT, 36 in x 50 yds, 1 per case

• Designed for 250°F (120°C) cure
• Adhesive can be cured from 180°F (80°C) up to 300°F (150°C)
• Excellent shop handling characteristics
• Short cure time at 225(deg)F (90 minutes)
• Capable of low pressure bonding
• A thermosetting, modified epoxy structural adhesive film for metal and composite laminates and honeycomb sandwich panels
• Reduces Aircraft on Ground time (AOG); short cure time at 225°F (107°C) in 90 minutes

Our 3M™ Scotch-Weld™ Structural Adhesive Film AF 163-2 encompasses a family of thermosetting modified epoxy adhesives in film form that provides long-term durability and meets specific challenges for metal and composite solid panel and honeycomb sandwich construction, where high fracture toughness and peel strength is required.

Helps to reduces cost; simplifies production and inventory management due to use on multiple substrates and compatibility with a variety of primers