3M™ Scotch-Weld™ Structural Adhesive Film AF 163-2K, .06WT, 36 in x 50 yd

• Designed for 250°F (120°C) cure
• Adhesive can be cured from 180°F (80°C) up to 300°F (150°C)
• Excellent shop handling characteristics
• Excellent pre-bond humidity performance on composite substrates

Our 3M™ Scotch-Weld™ Structural Adhesive Film AF 163-2 encompasses a family of thermosetting modified epoxy adhesives in film form that provides long-term durability and meets specific challenges for metal and composite solid panel and honeycomb sandwich construction, where high fracture toughness and peel strength is required.