Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications.Utilizes Sintered Abrasive Technology for superior diamond retention, with controlled diamond placement and protrusion.
- Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
- Optimized for extended pad and disk life
- Diamonds secured with both chemical and mechanical bonds for superior retention
- A160-CIP1 Dia Pad Cond. 4.25IN